Abstract collage of overlapping, bright-colored glowing circles
Series ended

ENG Distinguished Lecture: How Advanced Packaging Will Shape the Semiconductor Industry

About the series

Please join the U.S. National Science Foundation Directorate for Engineering on February 13, 2024, from 11 a.m. to 12 p.m. Eastern for a Distinguished Lecture by Intel Fellow Dr. Ravi Mahajan on “How Advanced Packaging Will Shape the Semiconductor Industry.”

Join the Lecture: Register in advance for this virtual event: https://nsf.zoomgov.com/webinar/register/WN_3wRgXV6MRkyqrh5mp8YmUg 

Real-time captions will be available via Zoom. Submit other accessibility accommodation requests in advance to rarequest@nsf.gov.

Abstract: Semiconductors are an essential component of electronic devices and are used in a myriad of sectors, including computing, healthcare, transportation, clean energy, and others. Heterogeneous integration is a powerful and crucial enabler for the continued growth of computing and communication performance by creating compact, power-efficient platforms for semiconductor devices. Heterogeneous integration involves the integration of separately manufactured components with different functions into a higher-level assembly that, in aggregate, provides enhanced functionality and improved operating characteristics.

This talk will first review the evolution of packaging to set context, describe the tremendous opportunities in different application environments, and focus on the projected evolution of advanced packaging architectures. Different packaging architectures will be compared based on their physical interconnect capabilities, power delivery, power removal, and high bandwidth signaling capabilities. Key features in leading-edge 2D and 3D technologies will be described, and a roadmap for their evolution will be presented.

Interest in heterogeneous integration research has picked up in recent years, and this opens up greater collaboration opportunities between academia and industry. Specific examples, showing how product implementations take advantage of currently available technologies to provide an unprecedented level of performance, will be used to describe the challenges and opportunities in developing robust, next-generation advanced package architectures.

In addition to performance characteristics, this talk will also illustrate key opportunities and challenges in materials development, manufacturability, and reliability, and describe how well-defined industry-academia partnerships can continue to ensure the successful evolution of the heterogeneous integration roadmap. 

Biography: Dr. Ravi Mahajan is an Intel Fellow responsible for exploring and developing innovative technologies for assembling and packaging semiconductor components, with a particular emphasis on future generations of semiconductor manufacturing technology. For over three decades he has led efforts to define and set strategic direction for package architecture, technologies, and assembly processes for multiple iterations of Intel packaging and assembly architectures and processes. Mahajan joined Intel in 1992 after earning a Ph.D. in Mechanical Engineering from Lehigh University.

A prolific inventor and recognized expert in microelectronics packaging technologies, Mahajan is an inventor on 151 patent families which have led to a total of 450 patents and applications. This includes the original patent for a silicon bridge that became the foundation for Intel’s Embedded Multi-Die Interconnect Bridge technology (EMIB), a packaging innovation that allows for increased performance and functionality of electronic devices while maintaining power efficiency and compact form. His early insights also led to high-performance, cost-effective cooling solutions for high-end microprocessors and the proliferation of photo-mechanics techniques used for thermo-mechanical stress model validation. Dr. Mahajan has written several book chapters and more than 50 papers on topics related to his area of expertise.

Mahajan's contributions during his Intel career have earned him numerous industry honors, including the Semiconductor Research Corporation’s 2015 Mahboob Khan Outstanding Industry Liaison Award and the 2016 Allan Kraus Thermal Management Medal. He was elected to the National Academy of Engineering in 2022 for contributions to advanced microelectronics packaging architectures and their thermal management.

Past events in this series